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Class Table

Each manufacturer has his own criteria to classify PCBs by "CLASS". Here above you will find the one used by us.

ItemClass IIIClass IVClass VClass VIClass VII

Minimum Platted Through Hole (PTH)

Minimum Platted Through Hole (PTH)

500 µm 300 µm 300 µm 200 µm 200 µm

Minimum Non Platted Through Hole (NPTH)

Minimum Non Platted Through Hole (NPTH)

600 µm 400 µm 400 µm 300 µm 300 µm

Width and isolation of copper conductors in outter layers (Base Copper)

Width and isolation of copper conductors in outter layers (Base Copper)

300 µm (17 µm)
300 µm (35 µm)
350 µm (70 µm)

200 µm (17 µm)
200 µm (35 µm)
250 µm (70 µm)
150 µm (17 µm)
175 µm (35 µm)
250 µm (70 µm)
125 µm (17 µm)
150 µm (35 µm)
250 µm (70 µm)
100 µm (17 µm)
125 µm (35 µm)

Width and isolation of copper conductors in inner layers (Base Copper)

Width and isolation of copper conductors in inner layers (Base Copper)

250 µm (17 µm)
300 µm (35 µm)
300 µm (70 µm)
150 µm (17 µm)
200 µm (35 µm)
250 µm (70 µm)
125 µm (17 µm)
150 µm (35 µm)
250 µm (70 µm)
100 µm (17 µm)
125 µm (35 µm)
200 µm (70 µm)
100 µm (17 µm)
100 µm (35 µm)

Copper annular ring for outter layers (Base Copper)

Copper annular ring for outter layers (Base Copper)

225 µm (17 µm)
225 µm (17 µm)
275 µm (17 µm)
200 µm (17 µm)
200 µm (35 µm)
250 µm (70 µm)
150 µm (17 µm)
175 µm (35 µm)
250 µm (70 µm)
125 µm (17 µm)
150 µm (35 µm)
250 µm (70 µm)
100 µm (17 µm)
125 µm (35 µm)

Copper annular ring for inner layers

Copper annular ring for inner layers

250 µm 220 µm 190 µm 170 µm 150 µm

Minimum isolation distance on inner layers (mass and power)

Aislamiento mínimo caras internas (masa y alimentación)

400 µm 400 µm 300 µm 250 µm 250 µm

Aspect Ratio (máximum raw material thickness)

Aspect Ratio (máximum raw material thickness)

8 (2,4 mm)
5 (3,2 mm)
8 (2,4 mm)
5 (3,2 mm)
8 (2,4 mm)
5 (3,2 mm)
8 (2,4 mm)
5 (3,2 mm)
8 (2,4 mm)
5 (3,2 mm)

REMARKS:

The pcb will become one class higher if at least one of the conditions of such a class is met

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