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Outsourcing

A service we understand as necessary these days is to have the possibility of depending on Production from the Far East and take advantage of to the low cost for high volume batches.

This is why we offer an outsourcing service with our Asian partners with who we have maintained a long ongoing relationship. Using this service means you still have all the technical support from our facility in Irun along with the low cost of Asia.

When Price becomes the main issue on your projects we offer this solution with all the guarantees and support from Spain.

specificationsCapability

Material Type
Flex Material
LDPP (Laser Drill PP)
FR-4 (standard Tg)
FR-4 Halogen Free (standard Tg)
FR-4 Halogen Free (high Tg)
FR-4 (high Tg)
Hydrocarbon ceramic high frequency material
PTFE high frequency material
PTFE Bonding film


Copper thickness 12µm; resin thickness between 65 and 100µm (Shengy material)
IT-180A 1037 (2 mils) and IT-180A 1086 (3 mils). ITEQ Material
S1141
S1155
S1165
FR408, IT180A, PCL-370HR, N4000-13, N4000-13S
Rogers4350, Rogers4003, 25FR, 25N
ROGERS, TACONIC, ARLON, NELCO
RO3001 (1.5 mils), HT1.5 (1.5 mil), CuClad6700 (1.5 mil)

Surface Finish type
Lead Free


HAL
Flash Gold (for base copper ≤ 35 µm)
ENIG (Electroless Niquel Inmersion Gold)
Inm. Ag (Chemical Silver)
Inm. Sn (Chemical Tin)
OSP (Organic Soldering Preservative)
Hard gold
Gold fingers (with any of previous finishings)

Surface plating or coating thickness
Tin thickness (HAL)
Flash Gold
ENIG
Inm.Sn
Inm.Ag
OSP
Hard gold
Carbon Thickness
Solder Mask thickness


Peelable solder mask thickness


2 - 40 µm
Ni: 3 - 5 µm; Au ≥ 0,025 µm
Ni: 3 - 5 µm; 0,05 µm ≥ Au ≥ 0,10 µm
Sn ≥ 1,0 µm
0,10 - 0,30 µm
0,20 - 0,30 µm
Au ≤ 2,5 µm
100 - 350 µm
10 - 18  µm (on copper area) and 5 - 8  µm (on via pad and line corner)
200 - 500 µm

Hole
Hole size (final diameter = d) for mechanical drilling



Hole size (final diameter = d) for laser drilling

Aspect Ratio = thickness "e"/diametre "d"


Hole position tolerance
PTH size tolerance
NPTH size tolerance
Relationship between hole size (finished) for plugging with resin and board thickness


Minimum laser drill hole size

Countersink hole


Countersink angle tolerance
Countersink hole size tolerance
Countersink depth tolerance
Slot size tolerance
Depth tolerance for blind NPTH slot routing
Minimum pad size for laser drilling

Minimum pad size for mechanical drilling


Minimum pad size for BGA
Pad size tolerance


0,10 ≤ d ≤ 6,5 mm
For PTFE material: d ≥ 0,25 mm
For blind / buried via holes: d < 0,30 mm
For plugged holes with resin: 0,10 mm ≤ d ≤ 0,40 mm
For blind holes plugged with resin: 0,075 mm ≤ d ≤ 0,15 mm
For blind holes plugged with copper: 0,075 mm ≤ d ≤ 0,127 mm
e ≤ 0,60 mm (for d = 0,10 mm)
e ≤ 1,20 mm (for d = 0,15 mm)
Aspect ratio ≤ 16 (for d > 0,20 mm)
± 3 mil
± 3 mil
± 2 mil (distribución: +0 /-2 mil o + 2 /-0 mil)
Thickness ≤ 1,6 mm : 0,15 mm
Thickness ≤ 2,4 mm : 0,20 mm
Thickness ≤ 2,8 mm : 0,25 mm
Thickness ≤ 3,2 mm : 0,30 mm
Depth ≤ 65 µm: 0,10 mm
Depth ≤ 100 µm: 0,13 mm
Standard. For diameter ≤ 3,175 mm: Angle 130º
Standard. For diameter 3,175 - 6,5 mm: Angle 165º
Special. For diameter 0,30 - 10 mm: Angle 82º, 90º and 120º
± 10º
± 0,20 mm
± 0,15 mm
± 0,15 mm
± 0,10 mm
Drill depth ≤ 65 µm : 10 mil
Drill depth ≤ 100 µm : 11 mil
14 mils (via 8 mil, Base Cu 17 - 35 µm)
20 mils (via 8 mil, Base Cu 70 µm)
24 mils (via 8 mil, Base Cu 70 µm)
7 mils
5% / -10%

Conductor width and space capability
Inner layers





Outer layers






Line width tolerance


3/3 mils (Base Copper 12 and 17 µm)
3/4 mils (Base Copper 35 µm)
5/5 mils (Base Copper 70 µm)
6/7 mils (Base Copper 105 µm)
7/11 mils (Base Copper 140 µm)
10/16 mils (Base Copper 170 µm)
3/3 mils (Base Copper 12 µm)
3,5/3,5 mils (Base Copper 17 µm)
4,5/5 mils (Base Copper 35 µm)
6/8 mils (Base Copper 70 µm)
8/14 mils (Base Copper 105 µm)
10/16 mils (Base Copper 140 µm)
12/20 mils (Base Copper 170 µm)
≤ 10 mil : ± 1,0 mil
> 10 mil : ± 1,5 mil

Space
Minimum gap between hole wall to line (blind and buried via PCB)
Minimum gap between hole wall to line (none blind and buried via PCB)

Minimum gap between laser hole to line (HDI pcb)
Minimum gap between outline and pattern for no copper exposure after routing
Minimum gap between hole wall and hole wall (same net)
Minimum gap between pads for inmersion gold

Minimum gap between gold fingers
Minimum gap between pads for HAL
Minimum gap beween peelable mask and pad
Minimum gap between legend and pad
Minimum gap between carbon pads


9 mil

≤ 8 layers: 6 mil
≤ 14 layers: 8 mil
≤ 28 layers: 9 mil
6 mil
8 mil

8 mil
4 mil
6 mil
7 mil (10 mil on large copper area)
16 mil
6 mil
15 mil

Other
Minimum core thickness

Number of layers
Thickness
Maximum board size
Register tolerance between layers
PCB thickness tolerance

Impedance tolerance

Outline dimension tolerance
Outline location tolerance
Minimum warpage
Maximum finished copper on inner layers
Minimun isolation thickness between layers
Minimum legend width
V-Cut angle tolerance
V-Cut symetrical tolerance
V-Cut rest thickness tolerance
Outline machining
Minimum soldermask bridge width
Solder mask colours
Legend colours
Angle tolerance of Gold Finger
Maximum test voltage
Maximum test currency


No blind neither buried via pcb: 0,05 mm
Blind and buried via pcb: 0,13 mm
2 - 40
0,13 - 7,0 mm
890 x 584 mm
≤ 5 mil
Thickness≤ 1,0 mm : ± 0,10 mm
Thickness> 1,0 mm : ± 10%
± 5 Ω (< 50 Ω)
± 10% ( ≥ 50 Ω); can be ± 5% under request
± 0,1 mm
± 0,1 mm
± 0,1%
350 µm
2 mils (only for Base Copper 17 µm)
4 mils
± 5º
± 4 mils
± 4 mils
Routing, V-Cut
4 mils for green solder mask; 5 mils another soldermask colour
Green, yellow, black, blue, red, white
White, yellow, black
± 5º
500 volts
200 mA

REMARKS

Information according to manufacturer´s Technical Data Sheets

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  • ZUBELZU S.L.
  • Printed Circuit Boards
  • C/Erregeoiana Nº9
  • Araso Industrial Estate
  • 20305 Irun (Spain)
  • Phone: +34 943 63 23 04
  • Fax:     +34 943 62 32 80
  • e-mail: