specifications | Capability |
Material Type Flex Material LDPP (Laser Drill PP) FR-4 (standard Tg) FR-4 Halogen Free (standard Tg) FR-4 Halogen Free (high Tg) FR-4 (high Tg) Hydrocarbon ceramic high frequency material PTFE high frequency material PTFE Bonding film
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Copper thickness 12µm; resin thickness between 65 and 100µm (Shengy material) IT-180A 1037 (2 mils) and IT-180A 1086 (3 mils). ITEQ Material S1141 S1155 S1165 FR408, IT180A, PCL-370HR, N4000-13, N4000-13S Rogers4350, Rogers4003, 25FR, 25N ROGERS, TACONIC, ARLON, NELCO RO3001 (1.5 mils), HT1.5 (1.5 mil), CuClad6700 (1.5 mil)
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Surface Finish type Lead Free
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HAL Flash Gold (for base copper ≤ 35 µm) ENIG (Electroless Niquel Inmersion Gold) Inm. Ag (Chemical Silver) Inm. Sn (Chemical Tin) OSP (Organic Soldering Preservative) Hard gold Gold fingers (with any of previous finishings)
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Surface plating or coating thickness Tin thickness (HAL) Flash Gold ENIG Inm.Sn Inm.Ag OSP Hard gold Carbon Thickness Solder Mask thickness
Peelable solder mask thickness
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2 - 40 µm Ni: 3 - 5 µm; Au ≥ 0,025 µm Ni: 3 - 5 µm; 0,05 µm ≥ Au ≥ 0,10 µm Sn ≥ 1,0 µm 0,10 - 0,30 µm 0,20 - 0,30 µm Au ≤ 2,5 µm 100 - 350 µm 10 - 18 µm (on copper area) and 5 - 8 µm (on via pad and line corner) 200 - 500 µm
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Hole Hole size (final diameter = d) for mechanical drilling
Hole size (final diameter = d) for laser drilling
Aspect Ratio = thickness "e"/diametre "d"
Hole position tolerance PTH size tolerance NPTH size tolerance Relationship between hole size (finished) for plugging with resin and board thickness
Minimum laser drill hole size
Countersink hole
Countersink angle tolerance Countersink hole size tolerance Countersink depth tolerance Slot size tolerance Depth tolerance for blind NPTH slot routing Minimum pad size for laser drilling Minimum pad size for mechanical drilling
Minimum pad size for BGA Pad size tolerance
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0,10 ≤ d ≤ 6,5 mm For PTFE material: d ≥ 0,25 mm For blind / buried via holes: d < 0,30 mm For plugged holes with resin: 0,10 mm ≤ d ≤ 0,40 mm For blind holes plugged with resin: 0,075 mm ≤ d ≤ 0,15 mm For blind holes plugged with copper: 0,075 mm ≤ d ≤ 0,127 mm e ≤ 0,60 mm (for d = 0,10 mm) e ≤ 1,20 mm (for d = 0,15 mm) Aspect ratio ≤ 16 (for d > 0,20 mm) ± 3 mil ± 3 mil ± 2 mil (distribución: +0 /-2 mil o + 2 /-0 mil) Thickness ≤ 1,6 mm : 0,15 mm Thickness ≤ 2,4 mm : 0,20 mm Thickness ≤ 2,8 mm : 0,25 mm Thickness ≤ 3,2 mm : 0,30 mm Depth ≤ 65 µm: 0,10 mm Depth ≤ 100 µm: 0,13 mm Standard. For diameter ≤ 3,175 mm: Angle 130º Standard. For diameter 3,175 - 6,5 mm: Angle 165º Special. For diameter 0,30 - 10 mm: Angle 82º, 90º and 120º ± 10º ± 0,20 mm ± 0,15 mm ± 0,15 mm ± 0,10 mm Drill depth ≤ 65 µm : 10 mil Drill depth ≤ 100 µm : 11 mil 14 mils (via 8 mil, Base Cu 17 - 35 µm) 20 mils (via 8 mil, Base Cu 70 µm) 24 mils (via 8 mil, Base Cu 70 µm) 7 mils 5% / -10%
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Conductor width and space capability Inner layers
Outer layers
Line width tolerance
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3/3 mils (Base Copper 12 and 17 µm) 3/4 mils (Base Copper 35 µm) 5/5 mils (Base Copper 70 µm) 6/7 mils (Base Copper 105 µm) 7/11 mils (Base Copper 140 µm) 10/16 mils (Base Copper 170 µm) 3/3 mils (Base Copper 12 µm) 3,5/3,5 mils (Base Copper 17 µm) 4,5/5 mils (Base Copper 35 µm) 6/8 mils (Base Copper 70 µm) 8/14 mils (Base Copper 105 µm) 10/16 mils (Base Copper 140 µm) 12/20 mils (Base Copper 170 µm) ≤ 10 mil : ± 1,0 mil > 10 mil : ± 1,5 mil
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Space Minimum gap between hole wall to line (blind and buried via PCB) Minimum gap between hole wall to line (none blind and buried via PCB)
Minimum gap between laser hole to line (HDI pcb) Minimum gap between outline and pattern for no copper exposure after routing Minimum gap between hole wall and hole wall (same net) Minimum gap between pads for inmersion gold
Minimum gap between gold fingers Minimum gap between pads for HAL Minimum gap beween peelable mask and pad Minimum gap between legend and pad Minimum gap between carbon pads
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9 mil
≤ 8 layers: 6 mil ≤ 14 layers: 8 mil ≤ 28 layers: 9 mil 6 mil 8 mil
8 mil 4 mil 6 mil 7 mil (10 mil on large copper area) 16 mil 6 mil 15 mil
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Other Minimum core thickness
Number of layers Thickness Maximum board size Register tolerance between layers PCB thickness tolerance
Impedance tolerance
Outline dimension tolerance Outline location tolerance Minimum warpage Maximum finished copper on inner layers Minimun isolation thickness between layers Minimum legend width V-Cut angle tolerance V-Cut symetrical tolerance V-Cut rest thickness tolerance Outline machining Minimum soldermask bridge width Solder mask colours Legend colours Angle tolerance of Gold Finger Maximum test voltage Maximum test currency
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No blind neither buried via pcb: 0,05 mm Blind and buried via pcb: 0,13 mm 2 - 40 0,13 - 7,0 mm 890 x 584 mm ≤ 5 mil Thickness≤ 1,0 mm : ± 0,10 mm Thickness> 1,0 mm : ± 10% ± 5 Ω (< 50 Ω) ± 10% ( ≥ 50 Ω); can be ± 5% under request ± 0,1 mm ± 0,1 mm ± 0,1% 350 µm 2 mils (only for Base Copper 17 µm) 4 mils ± 5º ± 4 mils ± 4 mils Routing, V-Cut 4 mils for green solder mask; 5 mils another soldermask colour Green, yellow, black, blue, red, white White, yellow, black ± 5º 500 volts 200 mA
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