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Class Table
Each manufacturer has his own criteria to classify PCBs by "CLASS". Here above you will find the one used by us.
| Item | Class III | Class IV | Class V | Class VI | Class VII |
|---|---|---|---|---|---|
|
Minimum Platted Through Hole (PTH)
|
500 µm | 300 µm | 300 µm | 200 µm | 200 µm |
|
Minimum Non Platted Through Hole (NPTH)
|
600 µm | 400 µm | 400 µm | 300 µm | 300 µm |
|
Width and isolation of copper conductors in outter layers (Base Copper)
|
300 µm (17 µm) |
200 µm (17 µm) 200 µm (35 µm) 250 µm (70 µm) |
150 µm (17 µm) 175 µm (35 µm) 250 µm (70 µm) |
125 µm (17 µm) 150 µm (35 µm) 250 µm (70 µm) |
100 µm (17 µm) 125 µm (35 µm) |
|
Width and isolation of copper conductors in inner layers (Base Copper)
|
250 µm (17 µm) 300 µm (35 µm) 300 µm (70 µm) |
150 µm (17 µm) 200 µm (35 µm) 250 µm (70 µm) |
125 µm (17 µm) 150 µm (35 µm) 250 µm (70 µm) |
100 µm (17 µm) 125 µm (35 µm) 200 µm (70 µm) |
100 µm (17 µm) 100 µm (35 µm) |
|
Copper annular ring for outter layers (Base Copper)
|
225 µm (17 µm) 225 µm (17 µm) 275 µm (17 µm) |
200 µm (17 µm) 200 µm (35 µm) 250 µm (70 µm) |
150 µm (17 µm) 175 µm (35 µm) 250 µm (70 µm) |
125 µm (17 µm) 150 µm (35 µm) 250 µm (70 µm) |
100 µm (17 µm) 125 µm (35 µm) |
|
Copper annular ring for inner layers
|
250 µm | 220 µm | 190 µm | 170 µm | 150 µm |
|
Minimum isolation distance on inner layers (mass and power)
|
400 µm | 400 µm | 300 µm | 250 µm | 250 µm |
|
Aspect Ratio (máximum raw material thickness)
|
8 (2,4 mm) 5 (3,2 mm) |
8 (2,4 mm) 5 (3,2 mm) |
8 (2,4 mm) 5 (3,2 mm) |
8 (2,4 mm) 5 (3,2 mm) |
8 (2,4 mm) 5 (3,2 mm) |
REMARKS:
The pcb will become one class higher if at least one of the conditions of such a class is met
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