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Technical Capabilities for Multilayer PCBs
| Capabilities | Minimum Capability | Maximum Capability | Tolerance | Remarks |
|---|---|---|---|---|
|
Metal finishing: |
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Final finishing: |
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- |
-
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Raw Material: |
130 ºC 150 ºC |
140 ºC 180 ºC |
- |
Depending on the manufacturer |
| Number of layers | 4 | 8 | - | - |
|
Base Copper (inner or outter layers) |
17 µm | 70 µm | - | Under request (consult delivery time): 105 μm |
|
Platted Through Hole (PTH)
|
200 µm | - | + 0,10 / - 0,05 mm | Or equivalent tolerance |
|
Non Platted Through Hole (NPTH)
|
300 µm | - | + 0,10 / -0 mm | Or equivalent tolerance |
|
Width and isolation of copper conductors in outter layers (Base Copper)
|
100 µm (17 µm) 125 µm (35 µm) 200 µm (70 µm) |
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± 25% ± 30% ± 30% |
- |
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Width and isolation of copper conductors in inner layers (Base Copper)
|
100 µm (17 µm) 100 µm (35 µm) 200 µm (70 µm) |
- |
± 25% ± 30% ± 30% |
- |
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Copper annular ring for outter layers (Base Copper)
|
100 µm (17 µm) 125 µm (35 µm) 250 µm (70 µm) |
- |
-
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Recommendation: for a good soldering surface, for component holes ≥ 200 µm |
|
Copper annular ring for inner layers
|
150 µm |
- |
- | - |
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Minimal isolation in inner layers (power and ground planes)
|
250 µm | - | - | - |
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Distance between NPTH and copper conductor
|
200 µm | - | - | - |
|
Distance between copper conductor and board edge (routed)
|
150 µm | - | - | - |
|
Misalignement between copper and PTH
|
- | - | ± 100 µm | - |
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Misalignement between outline and PTH
|
- | - | ± 150 µm | - |
|
Distance between a copper conductor and theorical scoring axis
|
500 µm | - | - | - |
|
Maximum hole to be plugged with peelable mask
|
0,30 mm | 1,80 mm | - | - |
|
Distance between peelable mask and copper pad
|
0,80 mm | - | - | - |
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Solder mask annular ring
|
50 µm | - | - | - |
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Solder mask bridge
|
100 µm | - | - | - |
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Distance between solder mask clearnace and copper conductor
|
50 µm | - | - | - |
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Misalignement between solder mask and copper
|
- | - | ± 150 µm | - |
|
Ink legend width
|
100 µm | - | - | - |
|
Misalignement between ink legend and copper
|
- | - | ± 200 µm | - |
|
Carbon Ink width
|
600 µm | - | - | - |
|
Separation between carbon conductors
|
400 µm | - | - | - |
|
Platted wall thickness
|
20 µm | 60 µm | - | Average: 25 μm |
|
Scoring positioning (taken on axis)
|
- | - | ± 150 µm | - |
|
Core thickness after scoring process
|
200 µm | - | ± 150 µm | Standard: 300 µm |
|
Misalignement between top-bottom scoring blades
|
- | - | ± 150 µm | - |
|
Final Thickness
|
0,80 mm | 3,2 mm |
± 10% (e > 1,0 mm) |
Depending on Multilayer stack-up and number of layers |
|
Bow&Twist
|
- | 0,75% of diagonal | - | - |
|
Final pcb dimensions (routing)
|
15 x 15 mm | 600 x 500 mm | < 30 mm: ± 0.10 mm < 120 mm: ± 0.15 mm >120 mm: ± 0.20 mm |
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Other |
- | - | - | According to IPC-A-600 revision G Standard |
REMARKS
1-The extra Cu deposition is performed by an electrolytic process; therefore It is extremely convenient that the density of Cu on both sides is similar. This reduces the irregularities in total Cu thickness, warping and bending, reduction in PTH diameters and the excess of Cu on conductors.
2.- It is important to eliminate nonfunctional pads on the inner layers (usually placed where PHTs go with no connection on that particular layer) in order to avoid short circuits.
3.- For class VI and VII PCBs the use of tear drops is highly recommended to compensate the quantity of Cu on both sides.
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