- Capabilities
Capabilities
PCB manufacturing capabilities and technologies
Explore the construction options for your circuit and the parameters that influence its manufacture. Our offering combines our Irun facility with complementary capabilities from international manufacturers.
For each project, we confirm the manufacturing location, materials and applicable combination of parameters. Published capabilities must be considered alongside their tolerances and conditions.
Single-sided, double-sided and multilayer. Constructions for arranging circuit interconnections, reference planes and power planes.
Aluminium IMS. Aluminium-base PCBs for applications requiring heat transfer, including options with insulated holes.
Flexible PCBs. Circuits that adapt interconnections to the equipment’s geometry and mechanical requirements.
Rigid-flex PCBs. Constructions combining rigid and flexible sections within a single circuit.
HDI PCBs. High-density interconnect options for designs requiring fine geometries and microvias.
High-frequency and high-speed. Materials and constructions selected according to signal requirements.
Copper-base PCBs. Copper-substrate constructions for applications requiring heat dissipation.
Ceramic substrates for electronics. Alumina and aluminium nitride options for specific thermal and insulation requirements.
Heavy-copper constructions. Available according to technology and specification. Conductor-layer copper thickness and base material are separate characteristics.
The base material affects a PCB’s electrical, thermal and mechanical performance. We review the construction, operating conditions and assembly process to establish the specification.
FR-4 refers to a family of materials; it does not mean that all laminates are interchangeable. If a project specifies a particular material, we check availability and agree on any alternative before using it.
CEM-1, IMS and specialist material options are confirmed according to construction and manufacturing location.
Tell us which material your project specifies. The selection is confirmed together with the technology, finish and supply conditions.
The solderable finish must be compatible with the design, assembly process and planned storage. We assess lead-free HASL (SnCuNi), immersion silver, immersion tin, ENIG, ENEPIG and OSP, depending on the construction and manufacturing process selected.
We specify the solder mask and legend separately, as well as conductive graphite or peelable mask applications where relevant.
Finish thicknesses, storage conditions and shelf life are defined in the applicable technical documentation. If you plan to store the PCB before assembly, let us know when defining the supply requirements.
