| OSP |
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| DESCRIPTION |
| An organic film that protects copper against oxidation until soldering, maintaining a flat surface without adding a metallic coating. A cost-effective solution for SMD assembly, particularly for fast-turnaround production where handling and thermal cycles are carefully controlled. |
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| THICKNESS |  | Typical thickness: 0.2–0.4 µm. |
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| STORAGE |  | Typical storage life before assembly: 6 months.* |
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| REFERENCE CONDITIONS |
| Storage conditions for unassembled boards kept in their original sealed packaging at 20–24 °C and 30–60% relative humidity. Final coating thicknesses and storage periods depend on the process and agreed specifications. Once the packaging has been opened, the relevant storage and assembly instructions must be followed. |
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