- Capabilities / PCB Types
Rigid-flex PCBs
Rigid-flex PCBs
Rigid-flex PCBs
Rigid-flex circuits integrate rigid and flexible sections to accommodate interconnections and mechanical integration within equipment. We review layer arrangement and transitions between sections alongside assembly requirements.
Rigid-flex and HDI combinations are assessed individually, distinguishing availability for samples from recurring production. Share your drawings and operating conditions so we can confirm the offering.
| Item | Unit | Rigid-Flex Board · Manufacturing Capabilities | |
| Highest Layer Number | ![]() | L | 30 |
| Maximum Finished Board Thickness | ![]() | mm | 4.0 |
| Maximum Production Size | ![]() | mm | 500*1000 |
| Minimum Laser Drilling | ![]() | mm | 0.075 |
| Maximum Thickness to Diameter Ratio | ![]() | / | 13:01 |
| Minimum Inner Line Width/Line Spacing | ![]() | mm | 0.04/0.04 |
| Minimum Outer Line Width/Line Spacing | ![]() | mm | 0.05/0.05 |
| Solder Resistance Alignment Tolerance | ![]() | mm | 0.035 |
| Minimum Soldermask Bridge | ![]() | mm | 0.08 |
| Minimum BGA Pitch | ![]() | mm | 0.08 |
| Single-Ended Impedance Tolerance | ![]() | mm | 0.45 |
| Single-Ended Impedance Tolerance | ![]() | % | ±7 |
| Raw Material | / | Medium TG, High TG, Low Dielectric Constant, Low Loss FR4, High Frequency Materials | |
| Surface Treatment | / | Immersion Gold, ENEPIG, OSP, Gold Plating, Gold Plating + Immersion Gold, Gold Plating +OSP, Immersion Silver, Immersion Tin, Tin Plating | |
| Rigid-Flex+HDI | ![]() | / | 3+N+3(Samples) |












