- Capabilities / PCB Types
High-Density (HDI) PCBs
HDI PCBs
HDI PCBs
HDI PCBs support designs with high interconnection density. We assess layer arrangement, microvias and circuit geometries to define a construction compatible with the manufacturing process.
Share the stack-up, via structure, files and signal requirements. We confirm the combination of parameters, inspections and supply conditions before manufacture.
| Item | Unit | HDI PCB · Manufacturing Capability | |
| Product Type | / | HDI ELIC（5+2+5） | |
| Number of PCB Layers |  | L | 1 - 32 |
| Board Thickness |  | mm | Inner Core Thickness：0.05 - 1.5；Finished Thickness：0.3 -3.5 |
| Minimum Aperture |  | mm/mil | Laser Drill: 0.075mm/3mil Mechanical Drill: 0.15mm/6mil |
| Minimum Line Width/Line Distance |  | mm | 0.030/0.030(1.2mil/1.2mil) |
| Copper Foil Thickness |  | OZ | 1/2 – 5 |
| Maximum Manufacturing Size |  | mm | 700*610 |
| Interlayer Alignment |  | mm | ± 0.05(2mil) |
| Contour Alignment |  | mm | ±0.075(3mil) |
| Minimum BGA PAD |  | mm | 0.15(8mil) |
| Aspect Ratio |  | / | 10:1 |
| Board Bending |  | % | 0.5 |
| Impedance Tolerance |  | % | ±8 |
| Commonly Used Raw Materials | / | FR4/NORMAL Tg/HIGH Tg/Low Dk/HF FR4/PTFE/PI | |
| Surface Treatment | / | Electroplating Nickel/Gold, OSP, HASL, Gold Plating, Immersion Tin |
