PCBs Rígido-Flexibles

ItemUnit Rigid-Flex Board · Manufacturing Capabilities
Highest Layer NumberL30
Maximum Finished Board Thicknessmm4.0
Maximum Production Sizemm500*1000
Minimum Laser Drillingmm0.075
Maximum Thickness to Diameter Ratio/13:01
Minimum Inner Line Width/Line Spacingmm0.04/0.04
Minimum Outer Line Width/Line Spacingmm0.05/0.05
Solder Resistance Alignment Tolerancemm0.035
Minimum Soldermask Bridgemm0.08
Minimum BGA Pitchmm0.08
Single-Ended Impedance Tolerancemm0.45
Single-Ended Impedance Tolerance%±7
Raw Material/Medium TG, High TG, Low Dielectric Constant, Low Loss FR4, High Frequency Materials
Surface Treatment/Immersion Gold, ENEPIG, OSP, Gold Plating, Gold Plating + Immersion Gold, Gold Plating +OSP, Immersion Silver, Immersion Tin, Tin Plating
Rigid-Flex+HDI/3+N+3(Samples)