- Capabilities / PCB Types
Ceramic substrates for electronics
Ceramic substrates for electronics
Ceramic substrates for electronics
We supply ceramic substrates for projects requiring specific thermal and insulation properties. The choice between alumina and aluminium nitride depends on construction, metallisation and operating conditions.
Share dimensions, thicknesses, geometries and thermal and electrical requirements. We confirm the process and parameter combination applicable to each material; capabilities for different processes are not considered interchangeable.
| Item | Unit | Ceramic Substrate · Manufacturing Capabilities | |||
| Minimum Aperture |  | mm | 0.05 | ||
| Aperture Taper Tolerance |  | % | ±30 | ||
| Drilling Hole Position Accuracy |  | mm | 0.025 | ||
| Slot Tolerance: Length ≥2 Times Width |  | mm | Long Side ±0.05, Wide Side ±0.025 | ||
| Slot Tolerance: Length <2 Times Width |  | mm | Long Side ±0.025, Wide Side ±0.010 | ||
| Line Alignment Accuracy |  | mm | ±0.025, Interlayer Alignment: 0.025 | ||
| Minimum Line Width & Line Distance |  | mm | 0.075/0.040 | ||
| Overall Line Width Compensation (DPC Process) |  | mm | 0.02(Regardless of Copper Thickness Limit, DPC Process Only) | ||
| Negative Film Direct Etching Process |  | mm | 1OZ Copper Thickness Line Width Compensation 0.025; 2OZ Copper Thickness Line Width Compensation 0.05; 3OZ Copper Thickness Line Width Compensation 0.075; 8OZ Copper Thickness Line Width Compensation 0.15 | ||
| Surface Copper Thickness |  | um | 18、35、70、140、300、400 | ||
| Filling Aspect Ratio |  | / | 8:1 | ||
| Etching Factor |  | / | ＞4 | ||
| Metal Dam |  | um | 50 - 800 | ||
| Ink Thickness (If customer specified thickness, then produce according to customer requirements) |  | um | Line Surface: ≥10; Line Angle: ≥8 | ||
| Cofferdam Ink Thickness |  | um | 80 - 120 | ||
| Solder Resistance Alignment Tolerance |  | mm | ±0.075 | ||
| Min. Width of One Side of Solder Cover Wire |  | mm | Face Copper 1OZ Min. Width: 0.075;Face Copper 2OZ Min. Width: 0.10;Face Copper 3OZ Min. Width: 0.15;Face Copper 4OZ Min. Width: 0.175 | ||
| Solder Resist Film Character Min. Window Opening (Min. Line Width) |  | mm | 0.15 | ||
| Min. Silkscreen Line Width |  | mm | ≥0.12 | ||
| Silkscreen Alignment Tolerance |  | mm | ±0.15 | ||
| Min. Silkscreen Height |  | mm | ≥0.75 | ||
| Min. Silkscreen Gap |  | mm | ≥0.10 | ||
| Immersion Gold |  | um | Gold Thickness: 0.025-0.10, Nickel Thickness: 2-8 | ||
| Immersion Silver |  | um | Silver Thickness: 0.2-0.5 | ||
| Immersion Tin |  | um | Tin thickness: 0.2-1 (Ceramic Substrate Can Not Use HASL Process) | ||
| OSP |  | / | OSP Film Thickness: 2-5um | ||
| ENEPIG |  | um | Gold Thickness: 0.025-0.050, Palladium Thickness: 0.025-0.075, Nickel Thickness: 2-8 | ||
| The Nearest Distance Between The Cutting Line and The Line |  | mm | 0.2 | ||
| Alignment of Top and Bottom Cutting Lines (Alignment Controlled by Double-Sided Scribing Board) |  | mm | ±0.025 | ||
| Residual Thickness Control Accuracy |  | mm | ±0.075. The inner scribing depth of the connected board is 1/2 of the thickness of the whole board, and the outer scribing depth of the peripheral board line is 2/3 of the thickness of the whole board | ||
| Offset Accuracy Tolerance |  | mm | ±0.025 | ||
| Laser Cutting Line Width |  | mm | 0.1 | ||
| Laser Contour Tolerance |  | mm | ±0.10 | ||
| LTCC Process Sintered Silver Paste - Thickness |  | um | 10 - 20 | ||
| LTCC Process Sintered Silver Paste - Line Width |  | mm | >0.1 | ||
| LTCC Process Sintered Silver Paste - Line Pitch |  | mm | >0.15 | ||
| Raw Material | Alumina | Alumina | Aluminium Nitride | ||
| Content |  | % | 96 | 99.60 | / |
| Appearance |  | / | White | White | White |
| Density |  | g/cm³ | 3.72 | 3.85 | 3.3 |
| Mean Particle Size |  | um | 3 - 4 | <1.5 | <1 |
| Thermal Conductivity |  | w/m·k | 22.3 | 29.5 | 170 |
| Coefficient of Thermal Expansion |  | / | 8x10-6/℃RT~800℃ | 8.2x10-6/℃RT~800℃ | 4.4x10-6/℃RT~800℃ |
| Dielectric Breakdown Source |  | v/m | 14*10^6 | 18*10^6 | 14*10^6 |
| Impedance Factor | / | >10^14 | >10^14 | >10^14 | |
| Dielectric Constant |  | 1MHz | 9.5 | 9.8 | 9 |
| Dielectric Loss Angle |  | 1MHz(x10-4) | 3 | 2 | 4 |
| Flexural Strength |  | Mpa | 350 | 500 | 300 |
| Dimension |  | mm | 114*114/120*120/127*127/130*140/140*190 | ||
| Thickness |  | mm | 0.2/0.25/0.3/0.38/0.5/0.635/0.8/1.0/1.2/1.5 | ||
| Warping Degree |  | % | ≤0.3 | ≤0.3 | ≤0.3 |
