- Capabilities / PCB Types
Aluminum PCBs
IMS (Insulated Metal Substrate) PCBs typically incorporate a metal base, an insulating dielectric and a conductive layer in a single-sided construction. The aluminium base helps distribute and transfer heat away from components.
Choosing the construction. We review dielectric material, copper thickness and mechanical integration. Heat dissipation also depends on contact with the heatsink or enclosure and the equipment’s operating conditions.
Applications. LED lighting and certain power electronics applications can benefit from this construction. The design must account for both thermal performance and electrical insulation.
We manufacture aluminium PCBs with insulated holes in Irun. Where a circuit incorporates through-hole terminals or connections, certain areas may need to be insulated from the metal base. We review the configuration and requirements to define a suitable manufacturing solution.
Defining the insulation your design needs
We review components passing through the board, available geometry and electrical and mechanical requirements. The aim is to maintain the intended electrical separation from the base.
Hole insulation and any associated plating are different characteristics. Both must be specified according to the connection’s function.
Information needed to assess the solution
Share drawings, details of through-hole components and insulation requirements. We can then assess the configuration, necessary inspections and manufacturing conditions.
| Item | Unit | Aluminum Substrate · Manufacturing Capabilities | |
| Finished Copper Thickness | ![]() | um | 18/25/35/70(0.5oz/0.75oz/1oz/2oz) |
| Board Thickness Range | ![]() | mm | 0.8 - 2.0 |
| Board Thickness Tolerance (t≥1.0mm) | ![]() | % | ±10 |
| Board Thickness Tolerance ( t<1.0mm) | ![]() | mm | ±0.1 |
| Thermal Conductivity | ![]() | w/mk | 1 - 12 |
| Minimum Line Width | ![]() | % | ±10 |
| Minimum Clearance | ![]() | mil | 8(0.2mm) |
| Drilling Diameter | ![]() | mm | ≥Board Thickness & ≥1.0 |
| Aperture Tolerance | ![]() | mm | ±0.1 |
| Soldermask Type | / | Photosensitive Ink | |
| Soldermask Bridge | ![]() | mm | 0.15 |
| Minimum Silkscreen Width | ![]() | mm | ≥0.15 |
| Minimum Silkscreen Height | ![]() | mm | ≥1.0 |
| Maximum Size | ![]() | mm | Standard:480*580 Large Size:580*1180(Support Customization) |
| Overall Dimensional Accuracy | ![]() | mm | ±0.15 |
| Distance Between Circuits and Shapes | ![]() | mm | ≥0.3(12mil) |
| Panel: No Gap Splicing | ![]() | / | 0 Gap Splicing (Panel Shipment, the Gap between the Middle Board and the Board is 0) |
| Panel: With Gap Splicing | ![]() | mm | 2.0 (The gap of the gap splicing should not be less than 2.0mm, otherwise it is more difficult to route edge) |
| Surface Treatment | / | Immersion Gold, Immersion Silver, Immersion Tin, OSP |
















