| Immersion Silver (Imm. Ag) |
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| DESCRIPTION |
| Silver is deposited onto the copper to provide a flat surface with good solderability for SMD, BGA and fine-pitch components. Special care is required during packaging and handling to prevent contaminants from degrading the surface. |
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| THICKNESS |  | Typical thickness: Ag 0.125–0.65 µm. |
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| STORAGE |  | Typical storage period before assembly: 12 months.* |
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| REFERENCE CONDITIONS |
| Storage guidelines for unassembled boards kept in their original sealed packaging at 20–24 °C and 30–60% relative humidity. Final coating thicknesses and storage periods depend on the process and the agreed specifications. Once the packaging has been opened, the applicable storage and assembly instructions must be followed. |
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