- Capabilities / PCB Types
Single-sided, Double-sided and Multilayer
• Single-sided PCBs
• Double-sided PCBs
• Multilayer PCBs
• Single-sided PCBs
We manufacture and supply single-sided printed circuit boards for designs whose connections can be accommodated on a single conductive layer. We review the material, geometries and finish according to the application and intended assembly process.
Applications and selection. This construction can suit interfaces, auxiliary electronics and control equipment with straightforward interconnection needs. Suitability depends on the design and operating conditions.
Materials and manufacturing. We work with FR-4 and CEM-1 options for specific projects. Selection should take electrical, mechanical and thermal requirements into account, as well as cost and availability.
Information for your enquiry. Share your files, dimensions, material, thickness, finish and quantities. If the specification is not yet final, tell us which aspects you need to review.
• Double-sided PCBs
Double-sided PCBs distribute connections across two conductive layers, usually interconnected by plated through-holes. Zubelzu manufactures double-sided FR-4 boards and organises supply to meet each project’s requirements.
Preparing for manufacture and assembly. We review track widths and clearances, annular rings, holes and copper distribution. We also coordinate panel layout and depanelisation methods with downstream assembly requirements.
Applications. Control modules, power supplies and interfaces can use this construction. Available space, interconnections and operating conditions determine its suitability.
Information for your enquiry. Send the files for both sides, drill data and available specifications, along with quantities and required date.
• Multilayer PCBs
Multilayer boards allow connections, reference planes and power distribution to be arranged across several copper layers. At Zubelzu, we review the construction to align design requirements with manufacturing.
Construction and materials. The stack-up defines layer order and copper and dielectric thicknesses. Agreeing it before manufacture establishes a common reference for final thickness and production requirements.
Manufacturing and supply. We manufacture 4-, 6- and 8-layer PCBs in Irun and supply constructions with more than eight layers through our international network. We confirm the stack-up and applicable parameter combination before preparing production.
Technical enquiry. Share the stack-up, files, final thickness and relevant electrical requirements. If you need controlled impedance, tell us so we can assess the applicable construction, tolerance and verification methods.
| Item | Item Name | Manufacturing Capabilities | |
| Overall Manufacturing Capacity | Number of Layers |  | 1-30L |
| High Frequency Hybrid Pressing HDI |  | Ceramic materials, PTFE materials can only be mechanically drilled blind holes or controlled deep drilling, backdrilling, etc. (Can not use laser drilling, can not directly press copper foil either) | |
| High Speed HDI |  | Made according to regular HDI | |
| Number of Laser Levels |  | Level 1-5 (Level 26 need to be reviewed) | |
| thickness range |  | 0.1-5.0mm (less than 0.2mm, more than 6.5mm need to be reviewed) | |
| Minimum Finished Size |  | Single Board 5 x 5mm (Less than 3mm must be reviewed) | |
| Maximum Finished Size |  | 2-20 layers 21*33 inch; Note: Board edges in short side exceeding 21 inch should be reviewed | |
| Maximum Finished Copper Thickness |  | Outer layer 8OZ(If higher than 8OZ needs to be reviewed), Inner layer 6OZ(If higher than 6OZ needs to be reviewed) | |
| Minimum Finished Copper Thickness |  | 1/2oz | |
| Interlayer Alignment |  | ≤3mil | |
| Through Hole Filling Range |  | Board Thickness <0.6mm, Aperture 0.2mm | |
| Resin Plug Hole Board Thickness Range |  | 0.254-6.0mm, PTFE board resin plug hole need to be reviewed | |
| Board Thickness Tolerance |  | Board Thickness <1.0mm; ± 0.1mm | |
| Board Thickness >1.0mm; ± 10% | |||
| Impedance Tolerance |  | ±5Ω (<50Ω), ±10% (≥50Ω); ±8% (≥50Ω, need to be reviewed) | |
| Warping Degree |  | General: 0.75%, Utmost 0.5% (need to be reviewed) Maximum 2.0% | |
| Number of Pressing |  | Press the same core board 35 times (more than 3 times need to be reviewed) | |
| Material Type | Ordinary Tg FR4 | ||
| Medium Tg FR4 | |||
| High Tg FR4 | |||
| Aluminum Substrate | |||
| Type of Material Used for HDI Board | |||
| High CTI | |||
| High Tg FR4 | |||
| Ceramic Powder Filled High Frequency Material | |||
| Polytetrafluoroethylene High Frequency Material | |||
| PTFE Prepreg | |||
| Mixed Pressing of Materials | |||
| Metal-Based Board | Number of Layers |  | Aluminum Substrate, Copper Substrate :1-8 Layers; Cold Board, Sintered Board, Buried Metal Board :2-24 Layers; Ceramic Substrate :1-2 Layers |
| Finished Size (Aluminum, Copper, Cold, Sintered, Buried Metal) |  | MAX:610*610mm、MIN:5*5mm | |
| Maximum Production Size (Ceramic Substrate) | | 100*100mm | |
| Finished Board Thickness |  | 0.5-5.0mm | |
| Copper Thickness | | 0.5-10 OZ | |
| Metal Base Thickness |  | 0.5-4.5mm | |
| Metal Base Material | AL:1100/1050/2124/5052/6061; Copper: Purple Copper Pure Iron | ||
| Minimum Finished Aperture and Tolerance |  | NPTH: 0.5±0.05mm; PTH(Aluminum Substrate, Copper Substrate): 0.3±0.1mm; PTH(Cold, Sintered, Buried Metal): 0.2±0.10mm | |
| Contour Machining Accuracy |  | ±0.2mm | |
| Partial PCB Surface Treatment Process |  | With/Without Lead HASL; OSP; ENEPIG; Electrical (Nickel) Soft/Hard Gold; Tin Plating; Nickel-Free Electroplating Soft/Hard Gold; Thick Gold Plating | |
| Metal Surface Treatment |  | Copper: Nickel/Gold Electroplating; Aluminum: Anodic Oxidation, Hard Oxidation, Chemical Passivation; Mechanical Treatment: Dry Sand Blasting, Wire Drawing | |
| Metal-Based Material | Quanbao Aluminum Substrate(T-110、T-111); Ventec Aluminum Substrate(VT-4A1、VT-4A2、VT-4A3); Laird Aluminum Substrate(1KA04、1KA06); Berges Metal Substrate(MP06503、HT04503); TACONIC Metal Substrate (TLY-5、TLY-5F) | ||
| Thermal Adhesive Thickness (Dielectric Layer) |  | 75-150um | |
| Buried Copper Block Size |  | 3*3mm—70*80mm | |
| Flatness of Copper Block |  | ±40um | |
| Distance from Copper Block to Hole Wall |  | ≥12mil | |
| Thermal Conductivity |  | 0.3-3W/m.k(Aluminum Substrate, Copper Substrate, Cold Board); 8.33W/m.k(Sintered Board); 0.35-30W/m.k(Buried Metal); 24-180W/m.k(Ceramic Substrate) | |
| Product Type | Rigid Board | Back Dirlling, HD, Multilayer Blind & Buried Hole Board, Heavy Copper Board, Power Supply Heavy Copper, Semiconductor Test Board | |
| Stacked-Up Method | Blind & Buried Hole Board with Multiple Times Pressing |  | Press together on the same side<3 |
| HDI Board | | 1+n+1、1+1+n+1+1、2+n+2、3+n+3(Buried Holes in n<0.3mm)，Laser blind holes can be electroplated and filled | |
| Partial Mixed Pressing | Minimum Distance from Mechanical Drilling to Conductor in Local Mixed Pressing |  | ≤10 Layers:14mil;12 Layers:15mil;>12 Layers:18mil |
| Minimum Distance between Local Mixed Pressing Junction and Borehole |  | ≤12 Layers:12mil;>12 Layers:15mil | |
| Surface Treatment | Without Leaded | Electroplating Copper Nickel Gold, Immersion Gold, Hard Gold Plating (With/Without Nickel), Gold Fingers Plating, HASL LF, OSP, ENEPIG, Soft Gold Plating (With/Without Nickel), Immersion Silver, Immersion Tin, ENIG+OSP, ENIG+G/F, Full Board Gold Plating+G/F, Immersion Silver+G/F, Immersion Tin+G/F | |
| With Leaded | HASL | ||
| Ratio of Thickness to Diameter |  | 10:1(With/Without Leaded HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG);8:1(OSP) | |
| Processing Size (MAX) | | Immersion Gold: 520*800mm, Vertical Immersion Tin: 500*600mm, Horizontal Immersion Tin: Single Sided ≤500mm; Horizontal Immersion Silver: Single Sided ≤500mm; With/Without Leaded HASL: 520*650mm; OSP: Single Sided ≤500mm; Hard Gold Plating: 450*500mm; Single Sided is not allowed to over 520mm | |
| Processing Size(MIN) |  | Immersion Tin: 60*80mm; Immersion Silver: 60*80mm; With/Without Leaded HASL: 150*230mm; OSP: 60*80mm; Smaller than the above size of the large board table | |
| Machined Board Thickness | | Immersion Gold:0.2-7.0mm，Immersion Tin:0.3-7.0mm(Vertical Immersion Tin Line)、0.3-3.0mm(Horizontal Immersion Tin Line);Immersion Silver:0.3-3.0mm;With/Without Leaded HASL:0.6-3.5mm;0.4mmThe following tin-spraying plates need to be made by review;OSP:0.3-3.0mm;Hard Gold Plating:0.3-5.0mm(Board Thickness Ratio10:1) | |
| Minimum Pitch of Metal Board IC or PAD to Wire |  | 3mil | |
| Gold Fingers Highest Height |  | 1.5inch | |
| Minimum Distance between Gold Fingers |  | 6mil | |
| Segment Gold Fingers Minimum Segment Spacing |  | 7.5mil | |
| HASL |  | 2-40um(The thinnest thickness of the large tin surface with lead spray tin is 0.4um, and the thinnest thickness of the large tin surface without lead spray tin is 1.5um) | |
| OSP |  | Film Thickness:0.2-0.4um | |
| ENIG |  | Nickel Thickness:3-5um;Gold Thickness:1-3uinch，>3uinch Need to be reviewed | |
| Immersion Silver |  | 0,125 - 0,65 um | |
| Immersion Tin |  | Tin Thickness>1um | |
| Hard Gold Plating |  | 2-50uinch | |
| Soft Gold Plating |  | Gold Thickness0.10-1.5um(Dry film plating process)，Gold Thickness0.10-4.0um(Non-dry film plating process) | |
| ENEPIG |  | Nl:3-5um，Pd:1-6uinch，Au:1-4uinch | |
| Electroplating Copper Nickel Gold | | Gold Thickness0.025-0.10um，Nickel Thickness>3um，MAX. Copper Base Thickness10Z | |
| Gold Fingers Plated with Nickel |  | Gold Thickness1-50uinch(Required value refers to the thinnest point)，Thickness>3um | |
| Carbon Oil |  | 10-50um | |
| Green Ink |  | Copper cover with oil(10-18um)、Cover the hole with oil(5-8um)、Line corner>5um(One printing, copper thickness below 48um) | |
| Blue Glue |  | 0.20-0.80mm | |
| Drilling | Mechanical hole diameter (finished product) |  | 0.10-6.2mm(corresponding drilling tool 0.15-6.3mm) |
| PTFE material (mixed pressure) plate minimum finished diameter 0.25mm(corresponding drilling tool 0.35mm) | |||
| Mechanical buried blind hole diameter ≤0.3mm(corresponding drilling tool 0.4mm) | |||
| Green oil plug hole drilling diameter ≤0.45mm(corresponding drilling tool 0.55mm) | |||
| Minimum hole diameter 0.35mm(corresponding drilling tool 0.45mm) | |||
| Metallized half hole diameter 0.30mm minimum (corresponding drilling tool 0.4mm) | |||
| The thick-diameter ratio of the through-hole plate is the largest | | 20:1(Not Including<0.2mmTool diameter ;>12:1Need to be reviewed) | |
| Laser drilling depth aperture ratio is maximum |  | 1:01 | |
| Mechanically controlled depth drilling has the largest ratio of blind hole depth to aperture | | 1.3:1(aperture<0.20mm),1.15:1(aperture≥0.25mm) | |
| Minimum depth of mechanical control drilling (back drilling) |  | 0.2mm | |
| Drilling - Minimum distance from mechanical drilling to conductor (unburied blind plate and first-order laser blind hole) |  | 5.5mil(≤8L);6.5mil(10-14);7mil(>14L) | |
| Drilling - Minimum distance from mechanical drilling to conductor (mechanical buried blind plate and second-order laser buried blind hole) |  | 7mil(One Time Pressing);8mil(Two Times Pressing);9mil(Three Times Pressing) | |
| Drilling - Minimum distance from mechanical drilling to conductor (laser blind hole) |  | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | |
| Drilling - Minimum distance from laser drilling to conductor body (1st and 2nd order HDI boards) |  | 5mil | |
| Drilling - Minimum distance between hole walls of different networks (after compensation) |  | 10mil | |
| Drilling - Minimum distance between holes in the same network (after compensation) |  | 6mil(Through-hole; Laser blind hole);10mil(Mechanical blind & buried hole) | |
| Drilling - Minimum distance between borehole and non-metal wall (after compensation) |  | 8mil | |
| Drilling-to-hole tolerance (compared to CAD data) |  | ±2mil | |
| Drilling -NPTH hole diameter tolerance is minimal |  | ±2mil | |
| Drilling - Precision of hole aperture of solderless device |  | ±2mil | |
| Drilling - taper hole depth tolerance |  | ±0.15mm | |
| Drilling - taper hole diameter tolerance |  | ±0.15mm | |
| Pad | Laser hole inner and outer pad size is minimum |  | 10mil(4mil Laser Hole)，11mil(5mil Laser Hole) |
| The inner and outer pads of mechanical holes are the smallest |  | 16mil(8mil Aperture ) | |
| BGA pad has the smallest diameter |  | HASL Process10mil，HASL LF Process12mil，Other Process7mil | |
| Pad tolerance (BGA) |  | +/-1.2mil(Pad<12mil);+/-10%(Pad>12mil) | |
| Line width/spacing | Copper thickness corresponding to the limit line width |  | 1/2OZ:3/3mil |
| 1OZ: 3/4mil | |||
| 2OZ: 5/5mil | |||
| 3OZ: 7/7mil | |||
| 4OZ: 12/12mil | |||
| 5OZ: 16/16mil | |||
| 6OZ:20/20mil | |||
| 7OZ:24/24mil | |||
| 8OZ:28/28mil | |||
| 9OZ:30/30mil | |||
| 10OZ: 32/30mil | |||
| Line width tolerance |  | ≤10mil: +/-1.0mil | |
| >10mil: +/-1.5mil | |||
| Soldermask & Silkscreen | Solder resistance jack maximum drilling diameter (covered with oil on both sides) |  | 0.5mm |
| Soldermask ink color |  | Green, yellow, black, blue, red, white, purple, matte green, matte black, high refraction white oil white, yellow, black | |
| Silkscreen ink color |  | White, black, yellow, red, green, blue | |
| Maximum diameter of the jack hole of the blue rubber aluminum sheet |  | 0.1-1.0mm | |
| Resin jack hole bore range | | 12:01 | |
| Maximum thickness to diameter ratio of resin jack |  | Green ink4mil、motley color 6mil Special requirements are required to control solder resistance Bridges | |
| Minimum width of solder shield bridge |  | White Silkscreen 3mil Height 24mil;Black Silkscreen 5mil Height 32mil | |
| Minimum character linewidth width |  | Hollow width 8mil Height 40mil | |
| Minimum spacing between hollow words |  | Hollow width 8mil Height 40mil | |
| Shape | V-CUT does not leak the distance from the center line of copper to the figure |  | H≤1.0mm:0.3mm(20° means V-CUT angle), 0.33mm(30°), 0.37mm(45°); |
| 1.0<H≤1.6mm:0.36mm(20°), 0.4mm(30°), 0.5mm(45°); | |||
| 1.6<H≤2.4mm:0.42mm(20°), 0.51mm(30°), 0.64mm(45°); | |||
| 2.4<H≤3.2mm:0.47mm(20°), 0.59mm(30°), 0.77mm(45°); | |||
| V-CUT symmetry tolerance |  | ±4mil | |
| V-CUT has the largest number of cables | 100 Times | ||
| V-CUT Angle tolerance |  | ±5° | |
| V-CUT Angle specifications |  | 20°、30°、45° | |
| Goldfinger chamfer Angle |  | 20°、30°、45° | |
| Goldfinger chamfer Angle tolerance |  | ±5° | |
| The minimum distance to TAB a goldfinger without getting hurt |  | 6mm | |
| Minimum distance between the side of the gold finger and the contour edge line |  | 8mil | |
| Depth control groove depth accuracy (NPTH) |  | ±0.10mm | |
| Overall dimensional accuracy (edge to edge) |  | ±8mil | |
| Milling groove hole minimum tolerance (PTH) |  | Groove width and groove length direction are equal±0.15mm | |
| Milling groove Hole minimum tolerance (NPTH) |  | Groove width and groove length direction are equal+0.10mm | |
| Minimum tolerance (PTH) |  | Slot width direction+0.075mm;Slot length/slot width<2:Slot length direction+/-0.1mm;Slot length/slot width>2:Slot length direction+/-0.075mmSlot width direction+0.05mm;Slot length/slot width<2:Slot length direction+/-0.075mm;Slot length/slot width>2:Slot length direction+/-0.05mm | |
| Minimum tolerance (NPTH) |  |
