- Capacidades / Tipos de PCB
Sustratos Cerámicos y Construcciones Especiales
Sustratos Cerámicos para Electrónica
Sustratos Cerámicos para Electrónica
Suministramos sustratos cerámicos para proyectos que requieren propiedades térmicas y de aislamiento específicas. La selección de alúmina o nitruro de aluminio se relaciona con la construcción, la metalización y las condiciones de uso.
Comparte dimensiones, espesores, geometrías y requisitos térmicos y eléctricos. Confirmamos el proceso y la combinación de parámetros aplicables a cada material; las capacidades de procesos distintos no se consideran intercambiables.
| Item | Unit | Ceramic Substrate · Manufacturing Capabilities | |||
| Minimum Aperture |  | mm | 0.05 | ||
| Aperture Taper Tolerance |  | % | ±30 | ||
| Drilling Hole Position Accuracy |  | mm | 0.025 | ||
| Slot Tolerance: Length ≥2 Times Width |  | mm | Long Side ±0.05, Wide Side ±0.025 | ||
| Slot Tolerance: Length <2 Times Width |  | mm | Long Side ±0.025, Wide Side ±0.010 | ||
| Line Alignment Accuracy |  | mm | ±0.025, Interlayer Alignment: 0.025 | ||
| Minimum Line Width & Line Distance |  | mm | 0.075/0.040 | ||
| Overall Line Width Compensation (DPC Process) |  | mm | 0.02(Regardless of Copper Thickness Limit, DPC Process Only) | ||
| Negative Film Direct Etching Process |  | mm | 1OZ Copper Thickness Line Width Compensation 0.025; 2OZ Copper Thickness Line Width Compensation 0.05; 3OZ Copper Thickness Line Width Compensation 0.075; 8OZ Copper Thickness Line Width Compensation 0.15 | ||
| Surface Copper Thickness |  | um | 18、35、70、140、300、400 | ||
| Filling Aspect Ratio |  | / | 8:1 | ||
| Etching Factor |  | / | ＞4 | ||
| Metal Dam |  | um | 50 - 800 | ||
| Ink Thickness (If customer specified thickness, then produce according to customer requirements) |  | um | Line Surface: ≥10; Line Angle: ≥8 | ||
| Cofferdam Ink Thickness |  | um | 80 - 120 | ||
| Solder Resistance Alignment Tolerance |  | mm | ±0.075 | ||
| Min. Width of One Side of Solder Cover Wire |  | mm | Face Copper 1OZ Min. Width: 0.075;Face Copper 2OZ Min. Width: 0.10;Face Copper 3OZ Min. Width: 0.15;Face Copper 4OZ Min. Width: 0.175 | ||
| Solder Resist Film Character Min. Window Opening (Min. Line Width) |  | mm | 0.15 | ||
| Min. Silkscreen Line Width |  | mm | ≥0.12 | ||
| Silkscreen Alignment Tolerance |  | mm | ±0.15 | ||
| Min. Silkscreen Height |  | mm | ≥0.75 | ||
| Min. Silkscreen Gap |  | mm | ≥0.10 | ||
| Immersion Gold |  | um | Gold Thickness: 0.025-0.10, Nickel Thickness: 2-8 | ||
| Immersion Silver |  | um | Silver Thickness: 0.2-0.5 | ||
| Immersion Tin |  | um | Tin thickness: 0.2-1 (Ceramic Substrate Can Not Use HASL Process) | ||
| OSP |  | / | OSP Film Thickness: 2-5um | ||
| ENEPIG |  | um | Gold Thickness: 0.025-0.050, Palladium Thickness: 0.025-0.075, Nickel Thickness: 2-8 | ||
| The Nearest Distance Between The Cutting Line and The Line |  | mm | 0.2 | ||
| Alignment of Top and Bottom Cutting Lines (Alignment Controlled by Double-Sided Scribing Board) |  | mm | ±0.025 | ||
| Residual Thickness Control Accuracy |  | mm | ±0.075. The inner scribing depth of the connected board is 1/2 of the thickness of the whole board, and the outer scribing depth of the peripheral board line is 2/3 of the thickness of the whole board | ||
| Offset Accuracy Tolerance |  | mm | ±0.025 | ||
| Laser Cutting Line Width |  | mm | 0.1 | ||
| Laser Contour Tolerance |  | mm | ±0.10 | ||
| LTCC Process Sintered Silver Paste - Thickness |  | um | 10 - 20 | ||
| LTCC Process Sintered Silver Paste - Line Width |  | mm | >0.1 | ||
| LTCC Process Sintered Silver Paste - Line Pitch |  | mm | >0.15 | ||
| Raw Material | Alumina | Alumina | Aluminium Nitride | ||
| Content |  | % | 96 | 99.60 | / |
| Appearance |  | / | White | White | White |
| Density |  | g/cm³ | 3.72 | 3.85 | 3.3 |
| Mean Particle Size |  | um | 3 - 4 | <1.5 | <1 |
| Thermal Conductivity |  | w/m·k | 22.3 | 29.5 | 170 |
| Coefficient of Thermal Expansion |  | / | 8x10-6/℃RT~800℃ | 8.2x10-6/℃RT~800℃ | 4.4x10-6/℃RT~800℃ |
| Dielectric Breakdown Source |  | v/m | 14*10^6 | 18*10^6 | 14*10^6 |
| Impedance Factor | / | >10^14 | >10^14 | >10^14 | |
| Dielectric Constant |  | 1MHz | 9.5 | 9.8 | 9 |
| Dielectric Loss Angle |  | 1MHz(x10-4) | 3 | 2 | 4 |
| Flexural Strength |  | Mpa | 350 | 500 | 300 |
| Dimension |  | mm | 114*114/120*120/127*127/130*140/140*190 | ||
| Thickness |  | mm | 0.2/0.25/0.3/0.38/0.5/0.635/0.8/1.0/1.2/1.5 | ||
| Warping Degree |  | % | ≤0.3 | ≤0.3 | ≤0.3 |
