• Capabilities / Special Processes

Peelable Mask or Kapton

∗∗- PEELABLE SOLDER MASK AND KAPTON
Technical information on peelable solder mask
DESCRIPTION
Peelable solder mask is designed to protect areas of the printed circuit board that must not be wetted by solder during assembly. Both the material and the process are suitable for all types of high-temperature lead-free assembly, from conventional wave soldering to multiple reflow cycles.
PARAMETERRANGE
Ink layer thickness200 – 800 um
PARAMETERSTANDARDSPECIAL
Minimum clearance0,50 mm0,30 mm
Distance to pad1,00 mm0,80 mm
Distance to board outline1,00 mm0,80 mm
Maximum hole diameter to cover1,30 mm1,50 mm
NOTE
WHEN TO USE KAPTON TAPE INSTEAD OF PEELABLE SOLDER MASK

• To cover holes, particularly those with diameters of 2 to 6.5 mm, where peelable solder mask may provide insufficient protection or tear during removal.
• When finer, more precise outlines or tolerances are required than peelable solder mask can achieve.
• To protect contacts, pads or gold fingers that are sensitive to residues during wave soldering or reflow.
• In high-temperature processes or with prolonged heat exposure: suitable polyimide tape can withstand temperatures of approximately 260 °C and be removed cleanly, whereas peelable solder mask may become brittle after extended reflow cycles.
• On uneven surfaces or localized areas requiring thin, conformable protection that can be removed immediately.

PRACTICAL GUIDELINE: use peelable solder mask for non-critical, repetitive areas because of its lower cost. Choose Kapton for demanding geometries, large holes or particularly sensitive areas. Tape generally requires manual cutting and placement, increasing costs; the specific tape grade, process temperature and exposure time must be validated.