| Immersion Tin (Imm. Sn) |
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| DESCRIPTION |
| A tin coating deposited onto copper, providing a uniform surface for assembling fine-pitch components and compatible press-fit connections. Assembly should be scheduled within the recommended storage period, and handling should be controlled to preserve solderability. |
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| THICKNESS |  | Typical thickness: >1 µm. |
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| STORAGE |  | Typical storage period before assembly: 12 months.* |
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| REFERENCE CONDITIONS |
| Storage guidelines apply to unassembled boards kept in their original sealed packaging at 20–24 °C and 30–60% relative humidity. Final coating thicknesses and storage periods depend on the process and the agreed specifications. Once the packaging has been opened, the applicable storage and assembly instructions should be followed. |
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