- Capabilities / PCB Types
High-frequency and high-speed PCBs
High-frequency and high-speed PCBs
High-frequency and high-speed PCBs
High-frequency and high-speed designs require signal requirements to be considered alongside circuit materials and construction. We review laminates, thicknesses and geometries to assess manufacturing options.
Specify the material, operating frequencies where relevant, stack-up, impedance requirements and tolerances. Hybrid constructions and special machining are confirmed on a project-by-project basis.
| Item | Unit | High Frequency High Speed Board · Manufacturing Capabilities | |
| Number of Layers |  | L | 2 - 30 |
| Maximum Board Thickness |  | mm | 8.0 |
| Finished Copper Thickness |  | OZ | 0.5 - 5 |
| Board Thickness Tolerance |  | % | ±10 |
| Maximum Finished Size |  | mm | 570*670 |
| Minimum Finished Size | | mm | 1*1 |
| Overall Dimensional Accuracy |  | mm | ±0.075 |
| Slot Dimensional Accuracy |  | mm | ±0.075 |
| Minimum Hole to Conductor Distance |  | mil | 5 |
| Minimum Aperture |  | mm | 0.05 |
| Minimum BGA Pitch |  | mm | 0.4 |
| The Minimum Hole Wall Spacing of Different Networks |  | mm | 0.2 |
| Aperture Tolerance |  | mil | ±2.0（PTH)；±1.0（NPTH) |
| Hole Tolerance |  | mil | ±2 |
| Back Drilling |  | mil | 4 |
| Ratio of Thickness to Diameter |  | / | 20:1 |
| Linewidth Accuracy |  | um | ±20 |
| Warping Degree |  | % | 0.75 |
| Wire Width Control |  | mm | ±0.02 |
| Impedance Tolerance |  | %（≥50Ω） | ±8 |
| Hole Copper Thickness |  | um | Min ≥18 且 Avg≥20 |
| Soldermask Thickness |  | um | 20 - 30 |
| High Frequency PCB Type | / | 6GHz to 24GHZ PCB, 70GHZ PCB, Embedded Antenna PCB, Ceramic Hybrid Base HF PCB, PTFE-based HF PCB | |
| Bottom Copper Thickness |  | OZ | 0.5 - 1.0 |
| Thermal Conductivity |  | w/mk | 0.15 - 0.95 |
| PCB Through Hole | / | Blind Hole, Overlapping Hole, Staggered Hole, Jumping Hole, Buried Hole | |
| Thermal Stress |  | / | 10 seconds at 288°C |
| Electric Conductivity | / | ℇ2.1 - ℇ10.0 | |
| Stamping or Wiring Error | mm | ±0.10 - 0.13 | |
| Wall Copper |  | um | ≥ 20 |
| Raw Material | / | Epoxy Resin, PTFE Resin, HC Resin, PPO PPE Resin | |
| Surface Treatment | / | Immersion Gold, Immersion Silver, Gold Plating, Immersion Tin, Tin Plating | |
| Special Surface Treatment | / | Copper Base Pure Thick Gold, Copper Base Palladium Gold, Nickel Base Thick Hard Gold and etc. |
