| ENEPIG |
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| DESCRIPTION |
| Electroless nickel, electroless palladium and immersion gold surface finish, suitable for assemblies combining soldering and wire bonding. It offers excellent flatness and versatility. Layer thicknesses and processing conditions must be tailored to the intended interconnection technology. |
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| THICKNESS |  | Typical thicknesses: Ni 3–5 µm / Pd 0.025–0.15 µm / Au 0.025–0.1 µm. |
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| STORAGE |  | Typical storage period before assembly: 12 months.* |
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| REFERENCE CONDITIONS |
| Storage guidelines for unassembled boards kept in their original sealed packaging at 20–24 °C and 30–60% relative humidity. Final thicknesses and storage periods depend on the process and agreed specifications. Once the packaging has been opened, the relevant storage and assembly instructions must be followed. |
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