| Lead-Free HASL (SnCuNi) |
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| DESCRIPTION |
| A tin, copper and nickel coating levelled using hot air, offering excellent solderability at a competitive cost. Suitable for conventional assembly processes; variations in coating thickness make it less suitable for fine-pitch components and applications requiring maximum flatness. |
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| THICKNESS |  | Indicative thickness: 2–40 µm. |
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| SHELF LIFE |  | Indicative shelf life before assembly: 18 months.* |
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| REFERENCE CONDITIONS |
| Storage guidelines apply to unassembled boards kept in their original sealed packaging at 20–24 °C and 30–60% relative humidity. Final coating thicknesses and storage periods depend on the process and the agreed specification. Once the packaging has been opened, the relevant storage and assembly instructions must be followed. |
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