- Capacidades / Tipos de PCB
PCBs de Alta Frecuencia y Alta Velocidad
PCB de Alta Frecuencia y Alta Velocidad
PCB de Alta Frecuencia y Alta Velocidad
Los diseños de alta frecuencia y alta velocidad requieren relacionar los requisitos de señal con los materiales y la construcción del circuito. Revisamos laminados, espesores y geometrías para evaluar las opciones de fabricación.
Indica el material especificado, las frecuencias de trabajo cuando sean relevantes, el stack-up y los requisitos de impedancia y tolerancia. Las construcciones híbridas y los mecanizados especiales se confirman según el proyecto.
| Item | Unit | High Frequency High Speed Board · Manufacturing Capabilities | |
| Number of Layers |  | L | 2 - 30 |
| Maximum Board Thickness |  | mm | 8.0 |
| Finished Copper Thickness |  | OZ | 0.5 - 5 |
| Board Thickness Tolerance |  | % | ±10 |
| Maximum Finished Size |  | mm | 570*670 |
| Minimum Finished Size | | mm | 1*1 |
| Overall Dimensional Accuracy |  | mm | ±0.075 |
| Slot Dimensional Accuracy |  | mm | ±0.075 |
| Minimum Hole to Conductor Distance |  | mil | 5 |
| Minimum Aperture |  | mm | 0.05 |
| Minimum BGA Pitch |  | mm | 0.4 |
| The Minimum Hole Wall Spacing of Different Networks |  | mm | 0.2 |
| Aperture Tolerance |  | mil | ±2.0（PTH)；±1.0（NPTH) |
| Hole Tolerance |  | mil | ±2 |
| Back Drilling |  | mil | 4 |
| Ratio of Thickness to Diameter |  | / | 20:1 |
| Linewidth Accuracy |  | um | ±20 |
| Warping Degree |  | % | 0.75 |
| Wire Width Control |  | mm | ±0.02 |
| Impedance Tolerance |  | %（≥50Ω） | ±8 |
| Hole Copper Thickness |  | um | Min ≥18 且 Avg≥20 |
| Soldermask Thickness |  | um | 20 - 30 |
| High Frequency PCB Type | / | 6GHz to 24GHZ PCB, 70GHZ PCB, Embedded Antenna PCB, Ceramic Hybrid Base HF PCB, PTFE-based HF PCB | |
| Bottom Copper Thickness |  | OZ | 0.5 - 1.0 |
| Thermal Conductivity |  | w/mk | 0.15 - 0.95 |
| PCB Through Hole | / | Blind Hole, Overlapping Hole, Staggered Hole, Jumping Hole, Buried Hole | |
| Thermal Stress |  | / | 10 seconds at 288°C |
| Electric Conductivity | / | ℇ2.1 - ℇ10.0 | |
| Stamping or Wiring Error | mm | ±0.10 - 0.13 | |
| Wall Copper |  | um | ≥ 20 |
| Raw Material | / | Epoxy Resin, PTFE Resin, HC Resin, PPO PPE Resin | |
| Surface Treatment | / | Immersion Gold, Immersion Silver, Gold Plating, Immersion Tin, Tin Plating | |
| Special Surface Treatment | / | Copper Base Pure Thick Gold, Copper Base Palladium Gold, Nickel Base Thick Hard Gold and etc. |
