- Capabilities / PCB Types
Copper-base PCBs
Copper-base PCBs
Copper-base PCBs
Copper-base PCBs incorporate a metal substrate for applications requiring heat transfer. We assess construction, insulation and mechanical integration according to the equipment’s operating conditions.
A copper base and heavy copper in conductive layers are distinct characteristics. Share your drawings and thermal and electrical requirements so we can confirm the configuration and manufacturing conditions.
| Item | Unit | Copper Substrate · Manufacturing Capabilities | |
| Number of Layers |  | L | 1 - 8 |
| Product Type | / | Single-Sided, Double-Sided Sandwich, Single-Sided 2 Layers, Single-Sided 4 Layers, Thermoelectric Separation (Convex Board) | |
| PCB Quality Standard | / | IPC-A-600/610 Class III/Class II | |
| Thermal Conductivity |  | W/mK | 1W/ MK-12W /mK, Thermoelectric Separation is 398W(Convex Board) |
| Maximum Copper Substrate PCB Size |  | mm | 1200*480 |
| Minimum Copper Substrate PCB Size |  | mm | 5*5 |
| PCB Thickness |  | mm | 0.5 - 5.0 |
| Finished Copper Thickness |  | OZ | 1 - 3 |
| Copper Thickness Through Hole Wall |  | um | 20 - 35 |
| Line Width/Spacing |  | mil | 1OZ : 4/5mil、2OZ : 6/8mil、3OZ : 10/11mil |
| PCB Warping |  | % | ≤0.5 |
| Minimum Punching Diameter |  | mm | 1.0 |
| Minimum Hole Diameter |  | mm | 0.6 |
| Minimum Soldermask | mm | 0.35 | |
| Contour Tolerance |  | mm | CNC±0.15，punching±0.1mm |
| Circuit Layer Copper Thickness |  | um | 35、70、105、140、175、210、245、280、315、350 |
| PCB Wiring Tolerance |  | mm | CNC routing : ±0.1mm, punching : ±0.1 |
| Surface Finish and Thickness |  | / | ENIG:Au 0.0254um to 0.127um, Ni 5um to 6umOSPHASL(LF): 40um to 100ymsilver plating: Ag 3um to 8umgold plating: Au 0.1um to 0.5um, Ni 4um to 6um |
