- Capacidades / Tipos de PCB
PCBs Simple Cara, Doble Cara y Multicapa
• PCB de Simple Cara
• PCB de Doble Cara
• PCB Multicapa
• PCB de Simple Cara
Fabricamos y suministramos circuitos impresos de simple cara para diseños que pueden resolver sus conexiones con una única capa conductora. Revisamos el material, las geometrías y el acabado de acuerdo con la aplicación y el montaje previsto.
Aplicaciones y elección. Esta construcción puede encajar en interfaces, electrónica auxiliar y equipos de control con necesidades de conexión sencillas. Su idoneidad depende del diseño y de las condiciones de uso.
Materiales y fabricación. Trabajamos con FR-4 y opciones CEM-1 para proyectos concretos. La elección debe considerar las necesidades eléctricas, mecánicas y térmicas, además del coste y la disponibilidad.
Información para la consulta. Comparte archivos, dimensiones, material, espesor, acabado y cantidades. Si todavía no has cerrado la especificación, indícanos qué aspectos necesitas revisar.
• PCB de Doble Cara
Los PCB de doble cara distribuyen las conexiones entre dos capas conductoras, habitualmente interconectadas mediante taladros metalizados. Zubelzu fabrica circuitos de doble cara en FR-4 y organiza su suministro según los requisitos de cada proyecto.
Preparación para fabricar y montar. Revisamos pistas y separaciones, coronas de cobre, taladros y distribución del cobre. También coordinamos el panel y el método de separación con las necesidades del montaje posterior.
Aplicaciones. Módulos de control, fuentes de alimentación e interfaces pueden emplear esta construcción. El espacio, las conexiones y las condiciones de funcionamiento determinan su adecuación.
Información para la consulta. Envía los archivos de ambas caras, el taladrado y las especificaciones disponibles, junto con cantidades y fecha de necesidad.
• PCB Multicapa
Los circuitos multicapa permiten organizar conexiones, planos de referencia y alimentación en varias capas de cobre. En Zubelzu revisamos la construcción para coordinar los requisitos del diseño con su fabricación.
Construcción y materiales. El stack-up define el orden de las capas y los espesores de cobre y dieléctrico. Acordarlo antes de fabricar permite mantener una referencia común para el espesor final y las condiciones de producción.
Fabricación y suministro. Fabricamos PCB de 4, 6 y 8 capas en Irún y suministramos construcciones de más de 8 capas mediante nuestra red internacional. Concretamos el stack-up y la combinación de parámetros aplicable antes de preparar la producción.
Consulta técnica. Comparte el stack-up, los archivos, el espesor final y los requisitos eléctricos relevantes. Si necesitas impedancia controlada, indícalo para evaluar la construcción, la tolerancia y la verificación aplicables.
| Item | Item Name | Manufacturing Capabilities | |
| Overall Manufacturing Capacity | Number of Layers |  | 1-30L |
| High Frequency Hybrid Pressing HDI |  | Ceramic materials, PTFE materials can only be mechanically drilled blind holes or controlled deep drilling, backdrilling, etc. (Can not use laser drilling, can not directly press copper foil either) | |
| High Speed HDI |  | Made according to regular HDI | |
| Number of Laser Levels |  | Level 1-5 (Level 26 need to be reviewed) | |
| thickness range |  | 0.1-5.0mm (less than 0.2mm, more than 6.5mm need to be reviewed) | |
| Minimum Finished Size |  | Single Board 5 x 5mm (Less than 3mm must be reviewed) | |
| Maximum Finished Size |  | 2-20 layers 21*33 inch; Note: Board edges in short side exceeding 21 inch should be reviewed | |
| Maximum Finished Copper Thickness |  | Outer layer 8OZ(If higher than 8OZ needs to be reviewed), Inner layer 6OZ(If higher than 6OZ needs to be reviewed) | |
| Minimum Finished Copper Thickness |  | 1/2oz | |
| Interlayer Alignment |  | ≤3mil | |
| Through Hole Filling Range |  | Board Thickness <0.6mm, Aperture 0.2mm | |
| Resin Plug Hole Board Thickness Range |  | 0.254-6.0mm, PTFE board resin plug hole need to be reviewed | |
| Board Thickness Tolerance |  | Board Thickness <1.0mm; ± 0.1mm | |
| Board Thickness >1.0mm; ± 10% | |||
| Impedance Tolerance |  | ±5Ω (<50Ω), ±10% (≥50Ω); ±8% (≥50Ω, need to be reviewed) | |
| Warping Degree |  | General: 0.75%, Utmost 0.5% (need to be reviewed) Maximum 2.0% | |
| Number of Pressing |  | Press the same core board 35 times (more than 3 times need to be reviewed) | |
| Material Type | Ordinary Tg FR4 | ||
| Medium Tg FR4 | |||
| High Tg FR4 | |||
| Aluminum Substrate | |||
| Type of Material Used for HDI Board | |||
| High CTI | |||
| High Tg FR4 | |||
| Ceramic Powder Filled High Frequency Material | |||
| Polytetrafluoroethylene High Frequency Material | |||
| PTFE Prepreg | |||
| Mixed Pressing of Materials | |||
| Metal-Based Board | Number of Layers |  | Aluminum Substrate, Copper Substrate :1-8 Layers; Cold Board, Sintered Board, Buried Metal Board :2-24 Layers; Ceramic Substrate :1-2 Layers |
| Finished Size (Aluminum, Copper, Cold, Sintered, Buried Metal) |  | MAX:610*610mm、MIN:5*5mm | |
| Maximum Production Size (Ceramic Substrate) | | 100*100mm | |
| Finished Board Thickness |  | 0.5-5.0mm | |
| Copper Thickness | | 0.5-10 OZ | |
| Metal Base Thickness |  | 0.5-4.5mm | |
| Metal Base Material | AL:1100/1050/2124/5052/6061; Copper: Purple Copper Pure Iron | ||
| Minimum Finished Aperture and Tolerance |  | NPTH: 0.5±0.05mm; PTH(Aluminum Substrate, Copper Substrate): 0.3±0.1mm; PTH(Cold, Sintered, Buried Metal): 0.2±0.10mm | |
| Contour Machining Accuracy |  | ±0.2mm | |
| Partial PCB Surface Treatment Process |  | With/Without Lead HASL; OSP; ENEPIG; Electrical (Nickel) Soft/Hard Gold; Tin Plating; Nickel-Free Electroplating Soft/Hard Gold; Thick Gold Plating | |
| Metal Surface Treatment |  | Copper: Nickel/Gold Electroplating; Aluminum: Anodic Oxidation, Hard Oxidation, Chemical Passivation; Mechanical Treatment: Dry Sand Blasting, Wire Drawing | |
| Metal-Based Material | Quanbao Aluminum Substrate(T-110、T-111); Ventec Aluminum Substrate(VT-4A1、VT-4A2、VT-4A3); Laird Aluminum Substrate(1KA04、1KA06); Berges Metal Substrate(MP06503、HT04503); TACONIC Metal Substrate (TLY-5、TLY-5F) | ||
| Thermal Adhesive Thickness (Dielectric Layer) |  | 75-150um | |
| Buried Copper Block Size |  | 3*3mm—70*80mm | |
| Flatness of Copper Block |  | ±40um | |
| Distance from Copper Block to Hole Wall |  | ≥12mil | |
| Thermal Conductivity |  | 0.3-3W/m.k(Aluminum Substrate, Copper Substrate, Cold Board); 8.33W/m.k(Sintered Board); 0.35-30W/m.k(Buried Metal); 24-180W/m.k(Ceramic Substrate) | |
| Product Type | Rigid Board | Back Dirlling, HD, Multilayer Blind & Buried Hole Board, Heavy Copper Board, Power Supply Heavy Copper, Semiconductor Test Board | |
| Stacked-Up Method | Blind & Buried Hole Board with Multiple Times Pressing |  | Press together on the same side<3 |
| HDI Board | | 1+n+1、1+1+n+1+1、2+n+2、3+n+3(Buried Holes in n<0.3mm)，Laser blind holes can be electroplated and filled | |
| Partial Mixed Pressing | Minimum Distance from Mechanical Drilling to Conductor in Local Mixed Pressing |  | ≤10 Layers:14mil;12 Layers:15mil;>12 Layers:18mil |
| Minimum Distance between Local Mixed Pressing Junction and Borehole |  | ≤12 Layers:12mil;>12 Layers:15mil | |
| Surface Treatment | Without Leaded | Electroplating Copper Nickel Gold, Immersion Gold, Hard Gold Plating (With/Without Nickel), Gold Fingers Plating, HASL LF, OSP, ENEPIG, Soft Gold Plating (With/Without Nickel), Immersion Silver, Immersion Tin, ENIG+OSP, ENIG+G/F, Full Board Gold Plating+G/F, Immersion Silver+G/F, Immersion Tin+G/F | |
| With Leaded | HASL | ||
| Ratio of Thickness to Diameter |  | 10:1(With/Without Leaded HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG);8:1(OSP) | |
| Processing Size (MAX) | | Immersion Gold: 520*800mm, Vertical Immersion Tin: 500*600mm, Horizontal Immersion Tin: Single Sided ≤500mm; Horizontal Immersion Silver: Single Sided ≤500mm; With/Without Leaded HASL: 520*650mm; OSP: Single Sided ≤500mm; Hard Gold Plating: 450*500mm; Single Sided is not allowed to over 520mm | |
| Processing Size(MIN) |  | Immersion Tin: 60*80mm; Immersion Silver: 60*80mm; With/Without Leaded HASL: 150*230mm; OSP: 60*80mm; Smaller than the above size of the large board table | |
| Machined Board Thickness | | Immersion Gold:0.2-7.0mm，Immersion Tin:0.3-7.0mm(Vertical Immersion Tin Line)、0.3-3.0mm(Horizontal Immersion Tin Line);Immersion Silver:0.3-3.0mm;With/Without Leaded HASL:0.6-3.5mm;0.4mmThe following tin-spraying plates need to be made by review;OSP:0.3-3.0mm;Hard Gold Plating:0.3-5.0mm(Board Thickness Ratio10:1) | |
| Minimum Pitch of Metal Board IC or PAD to Wire |  | 3mil | |
| Gold Fingers Highest Height |  | 1.5inch | |
| Minimum Distance between Gold Fingers |  | 6mil | |
| Segment Gold Fingers Minimum Segment Spacing |  | 7.5mil | |
| HASL |  | 2-40um(The thinnest thickness of the large tin surface with lead spray tin is 0.4um, and the thinnest thickness of the large tin surface without lead spray tin is 1.5um) | |
| OSP |  | Film Thickness:0.2-0.4um | |
| ENIG |  | Nickel Thickness:3-5um;Gold Thickness:1-3uinch，>3uinch Need to be reviewed | |
| Immersion Silver |  | 0,125 - 0,65 um | |
| Immersion Tin |  | Tin Thickness>1um | |
| Hard Gold Plating |  | 2-50uinch | |
| Soft Gold Plating |  | Gold Thickness0.10-1.5um(Dry film plating process)，Gold Thickness0.10-4.0um(Non-dry film plating process) | |
| ENEPIG |  | Nl:3-5um，Pd:1-6uinch，Au:1-4uinch | |
| Electroplating Copper Nickel Gold | | Gold Thickness0.025-0.10um，Nickel Thickness>3um，MAX. Copper Base Thickness10Z | |
| Gold Fingers Plated with Nickel |  | Gold Thickness1-50uinch(Required value refers to the thinnest point)，Thickness>3um | |
| Carbon Oil |  | 10-50um | |
| Green Ink |  | Copper cover with oil(10-18um)、Cover the hole with oil(5-8um)、Line corner>5um(One printing, copper thickness below 48um) | |
| Blue Glue |  | 0.20-0.80mm | |
| Drilling | Mechanical hole diameter (finished product) |  | 0.10-6.2mm(corresponding drilling tool 0.15-6.3mm) |
| PTFE material (mixed pressure) plate minimum finished diameter 0.25mm(corresponding drilling tool 0.35mm) | |||
| Mechanical buried blind hole diameter ≤0.3mm(corresponding drilling tool 0.4mm) | |||
| Green oil plug hole drilling diameter ≤0.45mm(corresponding drilling tool 0.55mm) | |||
| Minimum hole diameter 0.35mm(corresponding drilling tool 0.45mm) | |||
| Metallized half hole diameter 0.30mm minimum (corresponding drilling tool 0.4mm) | |||
| The thick-diameter ratio of the through-hole plate is the largest | | 20:1(Not Including<0.2mmTool diameter ;>12:1Need to be reviewed) | |
| Laser drilling depth aperture ratio is maximum |  | 1:01 | |
| Mechanically controlled depth drilling has the largest ratio of blind hole depth to aperture | | 1.3:1(aperture<0.20mm),1.15:1(aperture≥0.25mm) | |
| Minimum depth of mechanical control drilling (back drilling) |  | 0.2mm | |
| Drilling - Minimum distance from mechanical drilling to conductor (unburied blind plate and first-order laser blind hole) |  | 5.5mil(≤8L);6.5mil(10-14);7mil(>14L) | |
| Drilling - Minimum distance from mechanical drilling to conductor (mechanical buried blind plate and second-order laser buried blind hole) |  | 7mil(One Time Pressing);8mil(Two Times Pressing);9mil(Three Times Pressing) | |
| Drilling - Minimum distance from mechanical drilling to conductor (laser blind hole) |  | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | |
| Drilling - Minimum distance from laser drilling to conductor body (1st and 2nd order HDI boards) |  | 5mil | |
| Drilling - Minimum distance between hole walls of different networks (after compensation) |  | 10mil | |
| Drilling - Minimum distance between holes in the same network (after compensation) |  | 6mil(Through-hole; Laser blind hole);10mil(Mechanical blind & buried hole) | |
| Drilling - Minimum distance between borehole and non-metal wall (after compensation) |  | 8mil | |
| Drilling-to-hole tolerance (compared to CAD data) |  | ±2mil | |
| Drilling -NPTH hole diameter tolerance is minimal |  | ±2mil | |
| Drilling - Precision of hole aperture of solderless device |  | ±2mil | |
| Drilling - taper hole depth tolerance |  | ±0.15mm | |
| Drilling - taper hole diameter tolerance |  | ±0.15mm | |
| Pad | Laser hole inner and outer pad size is minimum |  | 10mil(4mil Laser Hole)，11mil(5mil Laser Hole) |
| The inner and outer pads of mechanical holes are the smallest |  | 16mil(8mil Aperture ) | |
| BGA pad has the smallest diameter |  | HASL Process10mil，HASL LF Process12mil，Other Process7mil | |
| Pad tolerance (BGA) |  | +/-1.2mil(Pad<12mil);+/-10%(Pad>12mil) | |
| Line width/spacing | Copper thickness corresponding to the limit line width |  | 1/2OZ:3/3mil |
| 1OZ: 3/4mil | |||
| 2OZ: 5/5mil | |||
| 3OZ: 7/7mil | |||
| 4OZ: 12/12mil | |||
| 5OZ: 16/16mil | |||
| 6OZ:20/20mil | |||
| 7OZ:24/24mil | |||
| 8OZ:28/28mil | |||
| 9OZ:30/30mil | |||
| 10OZ: 32/30mil | |||
| Line width tolerance |  | ≤10mil: +/-1.0mil | |
| >10mil: +/-1.5mil | |||
| Soldermask & Silkscreen | Solder resistance jack maximum drilling diameter (covered with oil on both sides) |  | 0.5mm |
| Soldermask ink color |  | Green, yellow, black, blue, red, white, purple, matte green, matte black, high refraction white oil white, yellow, black | |
| Silkscreen ink color |  | White, black, yellow, red, green, blue | |
| Maximum diameter of the jack hole of the blue rubber aluminum sheet |  | 0.1-1.0mm | |
| Resin jack hole bore range | | 12:01 | |
| Maximum thickness to diameter ratio of resin jack |  | Green ink4mil、motley color 6mil Special requirements are required to control solder resistance Bridges | |
| Minimum width of solder shield bridge |  | White Silkscreen 3mil Height 24mil;Black Silkscreen 5mil Height 32mil | |
| Minimum character linewidth width |  | Hollow width 8mil Height 40mil | |
| Minimum spacing between hollow words |  | Hollow width 8mil Height 40mil | |
| Shape | V-CUT does not leak the distance from the center line of copper to the figure |  | H≤1.0mm:0.3mm(20° means V-CUT angle), 0.33mm(30°), 0.37mm(45°); |
| 1.0<H≤1.6mm:0.36mm(20°), 0.4mm(30°), 0.5mm(45°); | |||
| 1.6<H≤2.4mm:0.42mm(20°), 0.51mm(30°), 0.64mm(45°); | |||
| 2.4<H≤3.2mm:0.47mm(20°), 0.59mm(30°), 0.77mm(45°); | |||
| V-CUT symmetry tolerance |  | ±4mil | |
| V-CUT has the largest number of cables | 100 Times | ||
| V-CUT Angle tolerance |  | ±5° | |
| V-CUT Angle specifications |  | 20°、30°、45° | |
| Goldfinger chamfer Angle |  | 20°、30°、45° | |
| Goldfinger chamfer Angle tolerance |  | ±5° | |
| The minimum distance to TAB a goldfinger without getting hurt |  | 6mm | |
| Minimum distance between the side of the gold finger and the contour edge line |  | 8mil | |
| Depth control groove depth accuracy (NPTH) |  | ±0.10mm | |
| Overall dimensional accuracy (edge to edge) |  | ±8mil | |
| Milling groove hole minimum tolerance (PTH) |  | Groove width and groove length direction are equal±0.15mm | |
| Milling groove Hole minimum tolerance (NPTH) |  | Groove width and groove length direction are equal+0.10mm | |
| Minimum tolerance (PTH) |  | Slot width direction+0.075mm;Slot length/slot width<2:Slot length direction+/-0.1mm;Slot length/slot width>2:Slot length direction+/-0.075mmSlot width direction+0.05mm;Slot length/slot width<2:Slot length direction+/-0.075mm;Slot length/slot width>2:Slot length direction+/-0.05mm | |
| Minimum tolerance (NPTH) |  |
