| ENIG |
| | | | | | | |
| DESCRIPTION |
| An electroless nickel and immersion gold finish that provides a flat surface, protects against oxidation and is suitable for high-density designs. An ideal choice for BGA and fine-pitch components when consistent assembly quality and a long shelf life are required. |
|
|
| | | | | | | |
| THICKNESS |  | Typical thicknesses: Ni 3–5 µm / Au 0.025–0.10 µm. (1 µin – 2 µin – 3 µin ...) |
| | | | | | | |
| STORAGE |  | Typical shelf life before assembly: 12 months.* |
| | | | | | | |
| REFERENCE CONDITIONS |
| Storage guidelines apply to unassembled PCBs kept in their original sealed packaging at 20–24 °C and 30–60% relative humidity. Final thicknesses and shelf life depend on the process and agreed specifications. Once the packaging has been opened, the applicable storage and assembly instructions must be followed. |
|
|
